[Offer to Sell] Dipping-type semi-conductive non-woven fabric intr20090811 |
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Dipping-type semi-conductive non-woven fabric introduction Production Code: HBFComposition: terylene short fabric, semi-conductive bonder Application: cable conductive binding;shielding under cable metal layer,other semi-conductive material for shielding. Regarding to above property and index, various products can be produced according to the customer requirement http://www.whongda.com/en/index.aspx | |||||||||||||||||
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